Sputtering systems HV/UHV

         All types of machines

  • Cylindrical or parallepipedic chambers, with front door or top lid
  • Standard chambers : 350, 400, 450, 600, 900 mm in diameter
  • Single-wafer load lock or cassette load lock
  • Rectangular or circular DC adn RF cathodes
  • Sputter up/down configurations
  • Clusters for confocal systems, co-sputtering
  • Reactive and non-reactive sputtering
  • Static or dynamic deposition, planetary and double planetary rotation, oscillation
  • RF bias on substrates prior to and during deposition
  • Substrate temperature up to 1000°C

          Application

  • Monolayers
  • Multilayers
  • Magnetic layers
  • Optical layers
  • Co-sputtering
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