Sputtering systems HV/UHV

         All types of machines

• Cylindrical or parallepipedic chambers, with front door or top lid
• Standard chambers : 350, 400, 450, 600, 900 mm in diameter
• Single-wafer load lock or cassette load lock
• Rectangular or circular DC adn RF cathodes
• Sputter up/down configurations
• Clusters for confocal systems, co-sputtering
• Reactive and non-reactive sputtering
• Static or dynamic deposition, planetary and double planetary rotation, oscillation
• RF bias on substrates prior to and during deposition
• Substrate temperature up to 1000°C