Sputtering systems HV/UHV

         All types of machines

  • Cylindrical or parallelepipedal chambers, with front door or top lid
  • Standard chambers : 350, 400, 450, 600, 900 mm in diameter
  • Single wafer or cassette load-lock
  • Rectangular or circular DC and RF cathodes
  • Sputter up/down configurations
  • Clusters for confocal systems, true co-sputtering
  • Reactive and non-reactive sputtering
  • Static or dynamic deposition, planetary and double planetary rotation, oscillation
  • RF bias on substrates prior to and during deposition
  • Substrate temperature up to 1000°C

          Application

Contact us