Sputtering systems HV/UHV
All types of machines
- Cylindrical or parallepipedic chambers, with front door or top lid
- Standard chambers : 350, 400, 450, 600, 900 mm in diameter
- Single wafer or cassette load-lock
- Rectangular or circular DC and RF cathodes
- Sputter up/down configurations
- Clusters for confocal systems, co-sputtering
- Reactive and non-reactive sputtering
- Static or dynamic deposition, planetary and double planetary rotation, oscillation
- RF bias on substrates prior to and during deposition
- Substrate temperature up to 1000°C
Application
- Monolayers
- Multilayers
- Magnetic layers
- Optical layers
- Co-sputtering